Applications:

Abrasive Grinding and Cutting: Used in the manufacture of grinding wheels, cutting wheels, and other bonded abrasives for metal, stone, and ceramics.

Abrasive Blasting: Commonly used in sandblasting for surface preparation, cleaning, and polishing hard surfaces such as metals and ceramics.

Ceramics Industry: As a raw material for producing ceramic parts, kiln furniture, and refractory products due to its high-temperature resistance.

Electronics Industry: Employed as a semiconductor material and for polishing and grinding semiconductor wafers in the production of electronic components.

Foundries and Metallurgy: Used as a deoxidizing agent in the steelmaking process and in the production of non-ferrous metal castings.

Surface Finishing: Applied for lapping, polishing, and precision surface finishing in industries requiring high surface quality and precision.

Technical Specifications:

Chemical Composition:

SiC (Silicon Carbide): ≥ 98%

Free Carbon: ≤ 0.5%

Fe₂O₃ (Iron Oxide): ≤ 0.2%

Hardness: Mohs hardness of 9.2-9.5

Density: 3.1-3.2 g/cm³

Grain Size: Available in various grit sizes from F16 to F220 (customizable based on application)

Melting Point: ~2700°C

Shape: Angular particles for superior cutting performance

Advantages:

Efficient Material Removal: Black Silicon Carbide’s sharp, angular grains provide fast cutting action, reducing grinding time and improving productivity.

Thermal Stability: Performs well in high-temperature environments, making it ideal for applications like refractory products and metal casting.

Wear Resistance: High hardness and low friability ensure long-lasting abrasive performance, reducing the need for frequent replacement.

Versatile Applications: Suitable for a wide variety of industries, including metalworking, ceramics, and electronics, where precision and durability are required.

Packaging: Available in 25 kg bags, 500 kg jumbo bags, or as per customer requirements.