Applications:

Optics and Glass: Used in the manufacture of high-precision optical lenses, mirrors, and windows due to its optical clarity and low thermal expansion.

Semiconductors: Employed in the semiconductor industry for applications such as wafer production, lithography masks, and substrate materials.

Refractories: Applied in the production of refractory materials for furnaces, kilns, and other high-temperature equipment to enhance thermal stability and resistance to thermal shock.

Casting: Used as a molding material for precision casting processes, particularly in the production of high-quality metal and glass components.

Technical Specifications:Utilized in various high-tech applications, including aerospace, telecommunications, and electronics, where its properties contribute to performance and reliability.

Technical Specifications:

Material Composition: Fused silica (SiO₂)

Purity: Typically ≥ 99.9% SiO₂

Density: Approximately 2.2 g/cm³

Melting Point: ~1710°C

Thermal Conductivity: Low thermal conductivity, contributing to good insulation properties

Thermal Expansion: Very low coefficient of thermal expansion, typically around 0.5 × 10⁻⁶ /°C

Advantages:

High Performance: Superior thermal stability, optical clarity, and chemical resistance provide enhanced performance in demanding applications.

Durability: High purity and low thermal expansion ensure long-lasting performance and reduced risk of material failure.

Versatility: Suitable for a wide range of applications, from optics to refractories and semiconductor manufacturing.

Consistency: Consistent quality and purity ensure reliable and predictable results.

Packaging: